Intel and Micron announce a 3D NAND technology for a new generation flash memory

A 3D NAND Die with an M.2 SSD (Image courtesy Intel. All rights reserved)
A 3D NAND Die with an M.2 SSD (Image courtesy Intel. All rights reserved)

Intel and Micron have announced a new technology for the production of 3D NAND flash memory. With its 32 layers of flash cells, it will allow to get a storage capacity three times higher than competitor NAND technologies in a “die”, a block of semiconductor material on which electronic circuits were created, of standard size. The result are 256 GB dies in the MLC (Multi Level Cell) type and 384 GB in the (Triple Level Cell) type.

For years, we’ve been told that the solid-state disks (SSDs) will replace traditional hard disks. However, the limits of storage capacity and cost are making this transition much slower than expected in the last decade. The progress of this technology continue but the benefits for ordinary users are noticed especially in mobile phones, tablets and other portable devices that use flash memory.

Classic NAND technology is reaching its limits with regard to its data density so lately manufacturers are developing a new tridimensional version. 3D NAND allows to have many vertical layers of flash cells, multiplying the capacity of the individual die. Recently, such solutions were announced from Samsung and Toshiba/SanDisk but Intel and Micron claim that the one produced by their collaboration is better.

With their 3D NAND technology, Intel and Micron will offer very high capacity, solving one of the SSDs problems. On SSDs the size of a chewing gum it will be possible to have more than 3.5 TeraBytes of space and on standard 2.5″ SSDs it will be possible to have more than 10 TeraBytes. In essence, these units can compete with classic hard disks in storage capacity.

What about the costs, the other problem of solid state disks? Intel and Micron have declared that the first generation of 3D NAND brings greater efficiency compared to planar NAND also from the point of view of costs. This will lead to a reduction in the prices of SSDs with this technology though no figures were provided.

256 GB MLC units using this 3 D NAND technology were already sent to selected partners and 384 GB TLC units will be sent during spring 2015. Industrial production should begin in the last quarter of 2015. Intel and Micron are developing autonomously their lines of 3D NAND SSD solutions, which should be available on the market in 2016. It might be the time for solid state disks to really begin to replace traditional hard disks.

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